ID: 171714
Tuotekoodi: TG-P-01
Voidaan tilata 30 yksiköt Saatavuus: 14 päivää tilauksen hyväksymisestä
Takuu: 2 vuotta
Gembird thermal pad, 100 x 100 x 1 mm
Kuva voi poiketa todellisesta tuotteesta, ja tuotteessa voi olla lisävarusteita ja osia, joita ei toimiteta varsinaisen tuotteen mukana.
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Postin pakettiautomaatti1-2 työpäivän kuluessa6,99 € -
Postitoimisto1-2 työpäivän kuluessa6,99 €
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Toimitus Posti-kuriirin postin välityksellä1-2 työpäivän kuluessa10,99 €
Kaikki parametrit
Tyyppi
: Lämpötyyny
Yksityiskohtaisempi erittely
Category Code - COA
Color - Gray
Colour - Grey
Description - Heatsink silicone thermal pad, 100 x 100 x 1 mm Keep your computer's CPU cool
Description - Heatsink silicone thermal pad 100 x 100 x 1 mm
Silicone thermal pad designed for merging with heat sinks It facilitates the removal of heat from the processor, chipset and processor to the heat sink Excellent thermal impedance It provides stability, perfectly merges, does not stratify, does not oxidize. It does not conduct electricity
Designation - CE+WEEE
dimension depth - 1 mm
dimension height - 140 mm
Dimensions - 100 x 100 x 1 mm
dimension weight - 23 g
dimension width - 100 mm
ean - 8716309102704
guarantee - 24
guarantee_type - normal
name - Heatsink silicone thermal pad 100 x 100 x 1 mm
Other parameters - Thermal conductivity: 2.0 W / m-K Specific gravity: 1.7 + 0.1 g / cm3 Hardness: 40 5 Shore C Continuous temperature of use: -40 ... +250 Dielectric breakdown voltage: 3-5 KV Dielectric constant: 4.5 - 5.5 1M Hz Volumetric resistivity:> 4.0 x 1011 cm Flame rating: V-0 Thermal impedance: 0.18 ... 0.25 -w2 / W
producer - Gembird
Product Net Weight - 0.02 kg
Unit Box Height - 0.002
Unit Box Length - 0.1
Unit Box Width - 0.1
Unit Calculated Volume - 2E-05 cubm
Unit Calculated Weight - 0.02 kg
Units per Shipping Box - 1
Vendor Homepage - gmb.nl/item.aspx?id=10270
vendpn - TG-P-01
Warranty - 24 months
Weight - 23 g
Color - Gray
Colour - Grey
Description - Heatsink silicone thermal pad, 100 x 100 x 1 mm Keep your computer's CPU cool
Description - Heatsink silicone thermal pad 100 x 100 x 1 mm
Silicone thermal pad designed for merging with heat sinks It facilitates the removal of heat from the processor, chipset and processor to the heat sink Excellent thermal impedance It provides stability, perfectly merges, does not stratify, does not oxidize. It does not conduct electricity
Designation - CE+WEEE
dimension depth - 1 mm
dimension height - 140 mm
Dimensions - 100 x 100 x 1 mm
dimension weight - 23 g
dimension width - 100 mm
ean - 8716309102704
guarantee - 24
guarantee_type - normal
name - Heatsink silicone thermal pad 100 x 100 x 1 mm
Other parameters - Thermal conductivity: 2.0 W / m-K Specific gravity: 1.7 + 0.1 g / cm3 Hardness: 40 5 Shore C Continuous temperature of use: -40 ... +250 Dielectric breakdown voltage: 3-5 KV Dielectric constant: 4.5 - 5.5 1M Hz Volumetric resistivity:> 4.0 x 1011 cm Flame rating: V-0 Thermal impedance: 0.18 ... 0.25 -w2 / W
producer - Gembird
Product Net Weight - 0.02 kg
Unit Box Height - 0.002
Unit Box Length - 0.1
Unit Box Width - 0.1
Unit Calculated Volume - 2E-05 cubm
Unit Calculated Weight - 0.02 kg
Units per Shipping Box - 1
Vendor Homepage - gmb.nl/item.aspx?id=10270
vendpn - TG-P-01
Warranty - 24 months
Weight - 23 g
